دانلود مجله FTM فوريه 2014– FTM February 2014
FTM February 2014:Application Spotlight:This month’s Application Spotlight is Embedded Arm Solutions. Featured Articles from: ARM Keil: Complete Development Environment for ARM® Cortex® -M Series Microcontrollers Lattice: MIPI Solutions for Embedded Systems Semtech: SX1276 – 137-1050MHz Ultra Low Power Long Range Transceiver STMicroelectronics: STM32 32-bit MCU Family
This Month’s Featured Articles
Lattice – iCE40, MachX02, LatticeECP3 : MIPI Solutions for Embedded Systems
Consumers expect their electronic devices to deliver the best possible, feature-rich experiences. This expectation is fueling the adoption of MIPI (Mobile Industry Processor Interface) interfaces & sensors by system architects and design engineers. For a widening set of embedded applications beyond just mobile handheld devices,
Cypress – PSoC 4 Programmable System-On-Chip
PSoC 4 has a 32-bit ARM Cortex-M0 system with programmable analog and digital that quickly upgrades legacy 8-bit and 16-bit systems.
PSoC Creator™ Integrated Design Environment enables concurrent co-design of application firmware and hardware, simplifying the design and debug of analog front ends and digital glue logic.
The CapSense Component, a free embedded IC in PSoC Creator, simplifies capacitive touch-sensing designs by allowing you to drag-anddrop CapSense on your schematic and develop with the included APIs.
PSoC Creator™ Integrated Design Environment enables concurrent co-design of application firmware and hardware, simplifying the design and debug of analog front ends and digital glue logic.
The CapSense Component, a free embedded IC in PSoC Creator, simplifies capacitive touch-sensing designs by allowing you to drag-anddrop CapSense on your schematic and develop with the included APIs.
TE Connectivity – High Speed Backplane Board-to-board Connectors
TE Connectivity offers a broad portfolio of high-speed, high-performance backplane connectors and cable assemblies for aggregate data rates greater than 100 GB/s (up to 40 GB/s per differential pair). • Enables orthogonal and cabled backplane architectures • Reduced connector noise and insertion loss • Optimized PCB footprints FEATURES • Impact Connector
